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LITEON and Elephantech Deepen Partnership to Further Drive Innovation and End-to-End Sustainability

LITEON Technology(2301.tw) has signed a second Memorandum of Understanding (MoU) with Elephantech, deepening their strategic partnership in advancing green Printed Circuit Boards (PCB) manufacturing. Announced on Earth Day (April 22), the renewed collaboration highlights their joint commitment to achieving net-zero carbon emissions.

Building upon their initial collaboration in 2023, which focused on developing low-carbon Flexible Printed Circuits(FPC) technology for commercial applications, this new agreement expands the scope to include equipment investment with integration into existing production lines in cooperative factories. The adoption of Elephantech’s proprietary technology will help inject new momentum into building a more sustainable supply chain.

Ms. Vicky Liang, head of LITEON Intelligent Peripheral Solution(left), and Mr. Shinya Shimizu, Representative Director(right), signing the memorandum

New milestone for Sustainability

Roger Chen, Director of LITEON+, the company's startup platform, stated: "The signing of our second MoU marks a new milestone in our partnership with Elephantech. We're moving beyond early-stage product applications in equipment investment. Through this advancement, we will be able to embed sustainability deeper into our operations and continue leading the industry in building sustainable competitiveness."

Since its establishment in 2023, LITEON+ has been dedicated to nurturing promising global startups that share a vision for sustainability. The platform provides resources, technology and accesses to international market expansion. Elephantech, as one of LITEON+'s first strategic partners, has been instrumental in developing innovative applications for low-carbon PCB technology.

Ms. Vicky Liang, head of LITEON Intelligent Peripheral Solution(left), and Mr. Shinya Shimizu, Representative Director(right), pose with the signed memorandum

Join Forces to Build Sustainable Competitiveness

Elephantech's agile startup model has rapidly accelerated new technology implementation. In just six months, both companies have successfully validated the feasibility of applying Elephantech’s technology to multilayer PCBs. Under this new MoU, LITEON plans to invest in Elephantech's proprietary PCB manufacturing equipment and implement it into existing cooperative factories to comprehensively upgrade production lines. This collaboration will help to reduce the carbon footprint of consumer electronics production, cut water and copper consumption, minimize environmental impact—ultimately enhancing sustainability throughout the supply chain and setting a new benchmark for green manufacturing.

Group Photo of attendees